Globalfoundries and NXP Semiconductor have jointly developed a next-generation embedded non-volatile memory (eNVM), which has resulted in production of 300mm prototype wafers on Globalfoundries’ 40nm process technology platform, according to the companies. Volume production is expected in 2016 at its Singapore facility.
It will enable faster time to market of high density on-chip eNVM for innovative applications in a variety of products including identification, near-field-communication, healthcare, and microcontrollers. NXP will leverage Globalfoundries’ semiconductor manufacturing capability to apply the overall technology to 40nm eNVM.
“We are pleased to see the co-developed 40nm-LP eNVM technology is ready for production in Globalfoundries facility,” said Hai Wang, executive VP of technology and operations at NXP. “Globalfoundries is the first foundry that developed this process technology specifically targeting markets that require embedded non-volatile memory products. The successful release to production will enable NXP to further strengthen our market leadership in offering advanced solutions for secure and near field communication market segments.”
Globalfoundries’ manufacturing site in Singapore is certified by the German Federal Office for Information Security (BSI) for secure IC products manufacturing. In 2012, the foundry received Common Criteria ISO 15408-EAL 6 certification and successfully received renewal in 2014.